t-ma x tm to-264 n-channel mosfet absolute maximum ratings thermal and mechanical characteristics g d s single die mosfet unit a v mj a unit w c/w c oz g inlbf nm ratings 24 15 90 30 1875 12 min typ max 1040 0 .12 0.11 -55 150 300 0 .22 6.2 10 1.1 parameter continuous drain current @ t c = 25c continuous drain current @ t c = 100c pulsed drain current 1 gate-source voltage single pulse avalanche energy 2 avalanche current, repetitive or non-repetitive characteristic total power dissipation @ t c = 25c junction to case thermal resistance case to sink thermal resistance, flat, greased surface operating and storage junction temperature range soldering temperature for 10 seconds (1.6mm from case) package weight mounting torque ( to-264 package), 4-40 or m3 screw symbol i d i dm v gs e as i ar symbol p d r jc r cs t j ,t stg t l w t torque typical applications ? pfc and other boost converter ? buck converter ? two switch forward (asymmetrical bridge) ? single switch forward ? flyback ? inverters features ? fast switching with low emi/rfi ? low r ds(on) ? ultra low c rss for improved noise immunity ? low gate charge ? avalanche energy rated ? rohs compliant apt24m120b2 APT24M120L 1200v, 24a, 0.68? max apt24m120b2 APT24M120L power mos 8 ? is a high speed, high voltage n-channel switch-mode power mosfet. a proprietary planar stripe design yields excellent reliability and manufacturability. low switching loss is achieved with low input capacitance and ultra low c rss "miller" capaci - tance. the intrinsic gate resistance and capacitance of the poly-silicon gate structure help control slew rates during switching, resulting in low emi and reliable paralleling, even when switching at very high frequency. reliability in ?yback, boost, forward, and other circuits is enhanced by the high avalanche energy capability. microsemi website - http://www.microsemi.com 050-8072 rev a 8-2006
static characteristics t j = 25c unless otherwise speci?ed source-drain diode characteristics dynamic characteristics t j = 25c unless otherwise speci?ed 1 repetitive rating: pulse width and case temperature limited by maximum junction temperature. 2 starting at t j = 25c, l = 26.04mh, r g = 2.2?, i as = 12a. 3 pulse test: pulse width < 380s, duty cycle < 2%. 4 c o(cr) is de?ned as a ?xed capacitance with the same stored charge as c oss with v ds = 67% of v (br)dss . 5 c o(er) is de?ned as a ?xed capacitance with the same stored energy as c oss with v ds = 67% of v (br)dss . to calculate c o(cr) for any value of v ds less than v (br)dss, use this equation: c o(er) = -3.80e-7/v ds ^2 + 4.62e-8/v ds + 6.57e-11. 6 r g is external gate resistance, not including internal gate resistance or gate driver impedance. (mic4452) microsemi reserves the right to change, without notice, the speci? cations and information contained herein. g d s unit v v/c ? v mv/c a na unit a v ns c v/ns unit s pf nc ns min typ max 1200 1.41 0 .55 0.68 3 4 5 -10 100 500 100 min typ max 100 200 1 1270 30 10 min typ max 27 8370 100 615 240 125 260 42 120 45 27 145 42 test conditions v gs = 0v , i d = 250a reference to 25c, i d = 250a v gs = 10v , i d = 12a v gs = v ds , i d = 2.5ma v ds = 1200v t j = 25c v gs = 0v t j = 125c v gs = 30v test conditions mosfet symbol showing the integral reverse p-n junction diode (body diode) i sd = 12a , t j = 25c, v gs = 0v i sd = 12a 3 di sd / dt = 100a/s, t j = 25c i sd 12a, di/dt 1000a/s, v dd = 800v, t j = 125c test conditions v ds = 50v , i d = 12a v gs = 0v , v ds = 25v f = 1mhz v gs = 0v , v ds = 0v to 800v v gs = 0 to 10v , i d = 12a, v ds = 600v resistive switching v dd = 800v , i d = 12a r g = 2.2? 6 , v gg = 15v parameter drain-source breakdown voltage breakdown voltage temperature coef? cient drain-source on resistance 3 gate-source threshold voltage threshold voltage temperature coef?cient zero gate voltage drain current gate-source leakage current parameter continuous source current (body diode) pulsed source current (body diode) 1 diode forward voltage reverse recovery time reverse recovery charge peak recovery dv/dt parameter forward transconductance input capacitance reverse transfer capacitance output capacitance effective output capacitance, charge related effective output capacitance, energy related total gate charge gate-source charge gate-drain charge turn-on delay time current rise time turn-off delay time current fall time symbol v br(dss) ?v br(dss) /?t j r ds(on) v gs(th) ?v gs(th) /?t j i dss i gss symbol i s i sm v sd t rr q rr dv/dt symbol g fs c iss c rss c oss c o(cr) 4 c o(er) 5 q g q gs q gd t d(on) t r t d(off) t f 050-8072 rev a 8-2006 apt24m120b2_l
v gs = 6, 7, 8 & 9v 4.5v t j = 125c t j = 25c t j = -55c v gs = 10v 5v v ds > i d(on) x r ds(on) max. 250sec. pulse test @ <0.5 % duty cycle normalized to v gs = 10v @ 12a t j = 125c t j = 25c t j = -55c c oss c iss i d = 12a v ds = 960v v ds = 240v v ds = 600v t j = 150c t j = 25c t j = 125c t j = 150c c rss t j = 125c t j = 25c t j = -55c v gs , gate-to-source voltage (v) g fs , transconductance r ds(on) , drain-to-source on resistance i d , drain current (a) i sd, reverse drain current (a) c, capacitance (pf) i d , drain current (a) i d , drian current (a) v ds(on) , drain-to-source voltage (v) v ds , drain-to-source voltage (v) figure 1, output characteristics figure 2, output characteristics t j , junction temperature (c) v gs , gate-to-source voltage (v) figure 3, r ds(on) vs junction temperature figure 4, transfer characteristics i d , drain current (a) v ds , drain-to-source voltage (v) figure 5, gain vs drain current figure 6, capacitance vs drain-to-source voltage q g , total gate charge (nc) v sd , source-to-drain voltage (v) figure 7, gate charge vs gate-to-source voltage figure 8, reverse drain current vs source-to-drain voltage 0 5 10 15 20 25 30 0 5 10 15 20 25 30 -55 -25 0 25 50 75 100 125 150 0 1 2 3 4 5 6 7 8 0 2 4 6 8 10 12 14 0 200 400 600 800 1000 1200 0 50 100 150 200 250 300 350 400 0 0.2 0.4 0.6 0.8 1.0 1.2 70 60 50 40 30 20 10 0 3.0 2.5 2.0 1.5 1.0 0.5 0 35 30 25 20 15 10 5 0 16 14 12 10 8 6 4 2 0 25 20 15 10 5 0 90 80 70 60 50 40 30 20 10 0 20,000 10,000 1 000 100 10 90 80 70 60 50 40 30 20 10 0 apt24m120b2_l 050-8072 rev a 8-2006
microsemi's products are covered by one or more of u.s.patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. us and foreign patents pending. all rights reserved. to-264 (l) package outline t-max? (b2) package outline 15.49 (.610) 16.26 (.640) 5.38 (.212) 6.20 (.244) 4.50 (.177) max. 19.81 (.780) 20.32 (.800) 20.80 (.819) 21.46 (.845) 1.65 (.065) 2.13 (.084) 1.01 (.040) 1.40 (.055) 5.45 (.215) bsc 2.87 (.113) 3.12 (.123) 4.69 (.185) 5.31 (.209) 1.49 (.059) 2.49 (.098) 2.21 (.087) 2.59 (.102) 0.40 (.016) 0.79 (.031) drai n source gate these dimensions are equal to the to-247 without the mounting hole. drai n 2-plcs. 19.51 (.768) 20.50 (.807) 19.81 (.780) 21.39 (.842) 25.48 (1.003) 26.49 (1.043) 2.29 (.090) 2.69 (.106) 0.76 (.030) 1.30 (.051) 3.10 (.122) 3.48 (.137) 4.60 (.181) 5.21 (.205) 1.80 (.071) 2.01 (.079) 2.59 (.102) 3.00 (.118) 0.48 (.019) 0.84 (.033) drai n source gate dimensions in millimeters and (inches) drai n 2.29 (.090) 2.69 (.106) 5.79 (.228) 6.20 (.244) 2.79 (.110) 3.18 (.125) 5.45 (.215) bsc 2-plcs. dimensions in millimeters and (inches) e3 100% sn plated 0.0474 0.0408 0.0316 0.0178 0.103 0.636 dissipated powe r (watts ) t j (c ) t c (c) z ext are the external therma l impedances: case to sink, sink to ambient, etc. set to zero when modeling onl y the case to junction. z ext 1ms 100ms r ds(on) 0.5 single pulse 0.1 0.3 0.7 0.05 d = 0.9 scaling for different case & junction temperatures: i d = i d(t c = 25 c) *( t j - t c )/125 peak t j = p dm x z jc + t c duty factor d = t 1 / t 2 t 2 t 1 p dm note : t 1 = pulse duration dc line 100s i dm 10ms 13s 100s i dm 100ms 10ms 13s r ds(on) dc line t j = 150c t c = 25c 1ms i d , drain current (a) v ds , drain-to-source voltage (v) v ds , drain-to-source voltage (v) figure 9, forward safe operating area figure 10, maximum forward safe operating area z jc , thermal impedance (c/w) 10 -5 10 -4 10 -3 10 -2 10 -1 1.0 rectangular pulse duration (seconds) figure 12. maximum effective transient thermal impedance junction-to-case vs pulse duration i d , drain current (a) figure 11, transient thermal impedance model 1 10 100 1200 1 10 100 1200 200 100 10 1 0.1 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 200 100 10 1 0.1 apt24m120b2_l t j = 125c t c = 75c 050-8072 rev a 8-2006
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